Innovative solutions to help improve productivity in the age of electronic components Advancement of wafer level packagin...

Nexteck Group majored in Semiconductors packing materials of Reel and tape, support the sloganLeading the Smart Future of...

In Semiconductor and Packing Materials industries, like WLCSP class precision carrier tape and cover tape manufacturer, N...

National Day 2020 will be a unique one in many ways. In the midst of a pandemic, we still have many reasons to celebrate ...

Embossed carrier tape is used for packing various tiny wafers, chips electronic components used in cell phones and precis...

Nexteck Group: Nexteck Technology (Shanghai) Limited, www.nexteck.cn is a great fan and supporter of electronica China, o...

Nexteck Reel changing Machine (ARC) Ver.3. is newly designed to be fully automatically linking to Chip Taping Machine. Ne...

Wafer Level Chip Scale Package (WLCSP) refers to the technology of packaging an integrated circuit at the wafer level, in...

There is some encouraging news under the slowdown in business of the industry. Nexteck Singapore Pte Ltd., Sales Team has...