NEXTECK SINGAPORE PTE LTD
ELEGRIP TAPE
COVER TAPE
| Tape Frame Size | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Frame Size | Wafer Diameter | Type | Part Numbers | Frame size (mm) | Material | Remarks | |||||||
| Outside Diameter | Min. Outer Diameter | Inside Diameter | |||||||||||
| Φ5 inch | Φ4 inch | NTF2-5-1 | NEXFF29-00 | 168.2 | - | 146 | Resin | Square | |||||
| Φ5 inch | NTF2-5 | NEXFF125-01 | 195 | 190 | 165 | Stainless steel | Round | ||||||
| Φ6 inch | Φ5 inch | NTF2-6 | NEXFF125-02 | 214 | 195 | 175 | Stainless steel | Standard type | |||||
| Φ6 inch | NTF2-6-1 | NEXFF150-03 | 228 | 212 | 194 | Stainless steel | Standard type | ||||||
| Φ8 inch | Φ8 inch | NTF2-8-1 | NEXFF200-04 | 296 | 276 | 250 | Stainless steel | Standard type | |||||
| 215x132 | NTFS215-01 | NEXFF215-01 | 296 | 276 | - | Stainless steel | Standard type | ||||||
| Φ12 inch | Φ12 inch | NTF2-12 | NEXFF300-05 | 400 | 380 | 350 | tainless steel | 1.5 mm thick | |||||
| NTF2-12-1 | NEXFF300-06 | 400 | 380 | 350 | Stainless steel | 1.2 mm thick | |||||||
| 250x250 | NTFS250-02 | NEXFF250-02 | 400 | 380 | - | Stainless steel | 1.5 mm thick | ||||||
Excellent sealing performance for heat-seal type embossed carrier tapes. Offers good, steady peeling characteristics.
Elegrip Dicing Tape used widely in silicon, GaAs semiconductors, encapsulated package substrates, ceramics & crystals.
Have electrical conductivity with Carbon Black. PS and PC based grades available for Carrier Tapes forming.
ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency
Cover tape film with excellent sealing performance
Dicing Tape,fixing semicon, silicon, GaAs during dicing
Back Grinding Tape,protect circuit surface during back grinding
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