Nexteck Singapore Pte Ltd., is the main supplier of Semiconductor tape the region of Singapore, Malaysia, Thailand, and the Philippines, wwww.nexteck.com.sg products are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.
Nexteck Group also carries dicing die attach film—which combines dicing tape with die attach film used to attach semiconductor chips to substrates and other objects—and continues to earn the praise and trust of customers with its technologies that enable the design, development, and manufacturing of proprietary “die attach film, adhesive, and backing layers.” Nexteck Singapore Pte Ltd., is more than happy to support you to COST DOWN and solve technical problem.
We are available info@nexteck.com.sg for 24/7 or ong.johnny@nexteck.com.sg
ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency
Cover tape film with excellent sealing performance
Dicing Tape,fixing semicon, silicon, GaAs during dicing
Back Grinding Tape,protect circuit surface during back grinding
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