Next Generation IC Packaging
Advanced semiconductor packaging combines multiple chips into a single compact unit, offering significant benefits. It increases functionality, reduces power use and costs, optimizes space, and improves performance. This is an essential advancement over traditional packaging methods.
The Key Techniques: 5D Packaging: Helps different chips communicate using an interposer. -3D Integrated Circuits (3D-IC): Stacks chips vertically to save space and boost performance. - Heterogeneous Integration: Combines chips with different functions in one package. - Fan-Out Wafer-Level Packaging (FOWLP): Increases connection points while keeping a small size. - System-in-Package (SiP): Merges several chips into one module to save space and enhance functionality.
We must address logistics and production issues for packing materials like carrier tape, WLCSP, cover tape, and dicing tapes. Nexteck Singapore Pte Ltd is focused on increasing production capacity and investing in research and development to meet these challenges.
