Cover Tape General Failure
Some end users of chips and LED sectors feedback to Nexteck Singapore Pte Ltd, R&D team that 0201 or even 01005 chips supplied in tape and reel format sometimes stick to the cover tape that is peeled off from the carrier tape during the assembly process.
As precautionary measure against ESD damage, a certain surface resistivity of the inner cover tape has to be assured. Since wafer Chip is very tiny and light, it can become more vulnerable to sticking on the cover tape if precautionary actions addressing the triboelectric effect are not well taken tape after taping process. PSA cover tape is widely used by component manufacturers and it is made to have a consistent peeling force over the whole tape length.
In order to prevent the triboelectric effect it is highly recommended to use an ionizer fan blowing directly to the Chips, LED’s during removal of the cover tape.
Below Preventive Action are recommended
# Proper machine grounding
# Use of an ionizer fan, with air flow directed to the LEDs during removal of cover tape
# Sufficient clearance between machine cover plate and reel cover tape to avoid friction process
# Use of ESD protective machine parts only
# Proper storage conditions.
Nexteck Group, Semiconductors and Wafer Packaging and Packing Division (SPPD) is more than happy to offer technical and material support on all cover, carrier / WLCSP tapes sol
