Semiconductor Packaging Material Market under CoronaVirus-cover tape|carrier tapes|NEXTECK

Semiconductor Packaging Material Market under CoronaVirus

Semiconductor Packaging Material Market 2020 under the impact of Coronavirus

Semiconductor Packaging Material Market Scenario

Semiconductor packaging materials are used in the final stage of semiconductor device fabrication and are used to safeguard devices from deterioration and external influence. The global semiconductor packaging material has perceived a noteworthy growth over the past few years owing to the growing demand for mobile phones, tablets, and other communication devices.
Furthermore, the market is projected to keep on increasing during the forecast period 2017-2023. The semiconductor packaging materials are major platform to the success of the semiconductor business across the sphere, and the shifting of the customer towards modern electronics are propelling the semiconductor packaging material market.
The global Semiconductor Packaging Material Market is expected to grow at a CAGR of 5% during the forecast period.

Key Players

The key players in the global Semiconductor Packaging Material Market are Henkel AG & Company, KGaA (Germany), Hitachi Chemical Company, Ltd. (Japan), Sumitomo Chemical Co., Ltd. (Japan), Kyocera Chemical Corporation (Japan), Denka Company Limited. (Japan), Mitsui High-tec, Inc. (Japan), Toray Industries, Inc. (Japan), Alent plc (U.K.), LG Chem (South Korea), BASF SE (Germany), Tanaka Kikinzoku Group (Japan), E. I. du Pont de Nemours and Company (U.S.), Honeywell International Inc. (U.S.), Toppan Printing Co., Ltd. (Japan), Nippon Micrometal Corporation (Japan), and Alpha Advanced Materials (U.S.).

Market Segmentation

The global semiconductor packaging material market has been segmented on the basis of technology, type, and lastly, region. The technology-based segmentation segments the market into the dual in-line package, dual flat no-leads, grid array, quad flat package, small outline package, and others. During the forecast period, grid array is projected to be the fastest-growing technology due to its wide application across all major semiconductor packaging type.
By type, the market has been segmented into bonding wires, ceramic packages, encapsulation resins, organic substrates, solder balls, wafer level packaging dielectrics, and others. During the forecast period, the organic substrates are expected to dominate the market due to their ability to form the base layers of single semiconductor devices and chips on which additional layers can be dumped to complete the circuit.

Regional Analysis

The regional segmentation of the global Semiconductor materials packing market segments the market into the regional markets, namely Europe, North America, Asia Pacific (of which Nexteck Singapore Pte Ltd. www.nexteck.com.sg has its East Asa Regional HQ in Singapore).

The Middle East & Africa (MEA). The Asia Pacific currently holds the highest position in the semiconductor packaging material market, and during the forecast period, the market is likely to rise further due to fast technological advancement and the developing demand for progressive electronic packaging materials from the end-users. At the same time, the large investments in electronics applications, easy convenience of the raw materials, low-cost manufacturing, and low workforce cost are pushing the market growth in this region. The prominent country-specific markets in this region are Australia, China, India, Japan, and South Korea, followed by the remaining countries of the Asia Pacific region.
North America is another important regional market due to technological advancement, various established industries, and the presence of many key market players. The pivotal country-specific markets in this region are USA and Canada.

Europe is another crucial regional market that is growing due to the reasons same as in North America. The significant country-specific markets in this region are France, Germany, Spain, and the UK, followed by the remaining countries of Europe. The MEA region is a small regional market due to poor countries, lack of awareness, lack of education, lack of infrastructure, and lack of technological advancement.

Latest outlook of Semiconductor industry to avoids direct impact of coronavirus outbreak

Coronavirus affect to Semiconductors and packing materials

However, suppliers face challenges ranging from logistic to packing and test capacity. The semiconductor industry appears to have escaped the direct impact of the coronavirus crisis so far, but the market is likely to suffer the repercussions as the outbreak slows or suspends production among electronics manufacturers, according to www.nexteck.com.sg

Despite facing logistical, packaging and test challenges related to the coronavirus, semiconductor fabs located in China are continuing to function normally, with high capacity rates.
However, the risks are considerable, given the semiconductor market represents a huge component of the global economy, generating an estimated $424.8 billion in revenue in 2019 alone, as a research by Nexteck Singapore Pte Ltd. A potential disruption to Chinese chip production could have major ramifications for worldwide economic growth.
“Global chip supply through the first two months of 2020 appears to be largely unaffected
by the coronavirus outbreak,” as we have feedback to our www.nexteck.com.sg online forum. The truth is: There’s plenty of chip inventory in the channel, compensating for any coronavirus-related production shortfalls at semiconductor fabs located in the Wuhan area and elsewhere in China. Also, few semiconductor suppliers are located in areas affected by the virus, and all of the parts sold by these companies can easily be sourced from other chipmakers.