Advanced Technology Insight | Highlights from IEEE IEDM-cover tape|carrier tapes|NEXTECK

Advanced Technology Insight | Highlights from IEEE IEDM

At Nexteck, we stay closely tuned to cutting-edge semiconductor advancements. The 70th IEEE IEDM (International Electron Devices Meeting) highlighted transformative innovations in logic device architecture:

Nanosheet-Based Transistors & 3D Complementary FETs (CFETs)

Nanosheets, a next-generation Gate-All-Around (GAA) architecture, provide enhanced electrostatic control and high drive current with variable channel widths—positioned to replace conventional FinFETs.

CFETs go further by stacking n-FET and p-FET nanosheets vertically, enabling high-density 3D integration without increasing footprint—paving the way for future Moore’s Law scaling.

Nexteck continues to invest in advanced materials and semiconductor packaging to support the industry’s evolution.

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Advanced Technology Insight | Highlights from IEEE IEDM

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