CHIPS Act Incentives from the U.S. Department of Commerce-cover tape|carrier tapes|NEXTECK

CHIPS Act Incentives from the U.S. Department of Commerce

WASHINGTON—Jan. 17, 2025—The Semiconductor Industry Association (SIA) issued the following statement from SIA President and CEO, John Neuffer, praising a series of agreements under the CHIPS and Science Act announced by the U.S. Department of Commerce. These agreements are set to support several significant initiatives, including:

The construction of a new semiconductor fab in California and an advanced packaging and test facility in Pennsylvania for Infinera.
The expansion of Corning’s High Purity Fused Silica and EXTREME ULE Glass manufacturing facility in New York.
The establishment of a cutting-edge dry vacuum pump manufacturing facility in New York for Edwards Vacuum.
The expansion of GlobalFoundries’ New York facilities to enable fully integrated wafer manufacturing and advanced packaging.

The CHIPS Act is poised to enhance U.S. manufacturing, create jobs, stimulate economic growth, and strengthen national security. Since its introduction and authorization during the first Trump administration, the CHIPS Act’s manufacturing incentives have driven significant investments in the U.S. semiconductor sector. To date, semiconductor companies have announced 90 new projects across 28 states, representing hundreds of billions of dollars in private investments. These projects are expected to generate over 58,000 direct jobs in the semiconductor ecosystem and create hundreds of thousands more jobs across the broader U.S. economy.

Our Products

CHIPS Act Incentives from the U.S. Department of Commerce

Our Products

Cover Tape

Thermo film

DICING TAPE

BACK GRINDING TAPE

Newsletter