NEPCON JAPAN - January 22-24, 2025 at Tokyo

NEXTECK has actively participated in NEPCON JAPAN, which has evolved alongside the growth of the electronics industry in Japan and Asia. The event focuses on key areas of electronics manufacturing and R&D and is recognized as Asia’s leading exhibition. 
 
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The event showcases seven specialized shows, each focusing on crucial areas of electronics manufacturing and research & development. As a leading exhibition in Asia, it serves as a key platform that unites professionals across the electronics sector, making it an ideal venue for business opportunities and expansion into the Japanese and broader Asian markets.
 

Our Products

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Cover Tape

HS4DWG , HSNGW, HSABT, Highly transparency

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Thermo film

Cover tape film with excellent sealing performance

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DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

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BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding

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