New Peeling Concept for Tiny Package of WLCSP
The difference between Interfacial peeling and Adhesive layer peeling.
Super Capability and studies on the design of Peeling on packing of tiny WLCSP contributed from the R&D team of Nexteck Singapore Pte Ltd, has successfully overcome the tough issue on super tiny semiconductor chip on Cover Tape interfacial delamination technology on peeling process.
The demanding Semiconductor Industry has stronger demand on a Super Stable Capability of Peeling on Cover tape in paring with carrier tape to protect the valuable chips, in logistic. But most important, is the safety of peeling process from reels and tapes during the finial assemble operation.
Nexteck Super Capability Peeling Cover Tape is specially designed and developed to meet below tough qualification.
Ultra-low peeling static voltage,
Ultra-low throwing detect rate,
Ultra-low dome-high film design,
Comply with ANSI/ESD S541 E.7 specification.
Nexteck Singapore Pte Ltd is a key supplier of precision packing materials of WLCSP cover tape and carrier tape to major Semiconductor Plants in Singapore, Malaysia, Thailand and the Philippines.
