Cover Tape_HSABT_HSNGW_HSNTKP-NEXTECK

COVER TAPE

Features

Complies with EIA-481 standards
Suitable for any heat taping application
Transparent to allow post-taping
inspection of components in the pocket
Proven to perform with Nexteck
Carrier Tape materials of Polystyrene and Polycarbonate
High, consistent adhesion
Halogen-Free

Shelf Life and Storage

We recommend that the HSABT/ HSDMT/ HSNXT/ HSNGW/ HSNTK/ HSNTKP/ HS4DWG cover tape be used within 24 months from the date of manufacture. Store this product in its original packag-ing in a climate-controlled environment with temperatures between 20°C~30°C and relative humidity between 30%~80%. Do not store in direct sunlight or excess temperature/humidity for prolonged periods of time. Allow the product to stabilize at roomtemperature for 48 hours prior to use.

Material Properties
Type (Heat Activated)	HSABT	HSDMT	HSNXT	HSNGW	HSNTK	HSNTKP	HS4DWG
Thickness	0.052mm	0.053mm	0.059mm	0.048mm	0.059mm	0.055mm	0.047mm
Tensile Strength	60Mpa	60Mpa	60Mpa	60Mpa	330Kg/cm²	330Kg/cm²	70Mpa
Transparency	Transmittance: 90%	Transmittance: 90%	Transmittance: 90%	Transmittance: 90%	Transmittance: 90%	Transmittance: 90%	Transmittance: 90%
Color	Transparent	Transparent	Transparent	Transparent	Transparent	Transparent	Transparent
Haze	18%	30%	15%	20%	15%	18%	18%
Surface Resistivity	Pet Side: 10¹⁰ Ω/sq Sealant Side: 10⁸ Ω/sq	Pet Side: 10¹⁰ Ω/sq Sealant Side: 10¹⁰ Ω/sq	Pet Side: 10¹⁰ Ω/sq Sealant Side: 10⁹ Ω/sq	Pet Side: 10¹⁰ Ω/sq Sealant Side: 10¹⁰ Ω/sq	Pet Side: 10¹⁰ Ω/sq Sealant Side: 10⁹ Ω/sq	Pet Side: 10¹¹ Ω/sq Sealant Side: 10¹⁰ Ω/sq	Pet Side: 10¹⁰ Ω/sq Sealant Side: 10⁸ Ω/sq

Reference Sealing Condition
Type (Heat Activated)	HSABT	HSDMT	HSNXT	HSNGW	HSNTK	HSNTKP	HS4DWG
Temperature	140 - 220°C	140 - 230°C	140 - 190°C	150 - 190°C	140 - 190°C	130 - 190°C	130 - 200°C
Dwell Time	0.02 - 0.50 sec.	0.01 - 0.50 sec.	0.01 - 0.50 sec.	0.1 - 0.50 sec.	0.01 - 0.50 sec.	0.1 - 0.50 sec.	0.01 - 0.50 sec.
Pressure	20 - 70 PSI	30 - 80 PSI	20 - 70 PSI	20 - 70 PSI	20 - 70 PSI	20 - 70 PSI	20 - 70 PSI
Seal Rail Width	0.015 - 0.020” (0.38-0.51mm)	0.015 - 0.020” (0.38-0.51mm)	0.015 - 0.020” (0.38-0.51mm)	0.015 - 0.020” (0.38-0.51mm)	0.015 - 0.020” (0.38-0.51mm)	0.015 - 0.020” (0.38-0.51mm)	0.015 - 0.020” (0.38-0.51mm)
Product

Ordering Information
HSABT		HSDMT		HSNXT		HSNGW		HSNTK		HSNTKP		HS4DWG
Part number	Width (mm)	Part number	Width (mm)	Part number	Width (mm)	Part number	Width (mm)	Part number	Width (mm)	Part number	Width (mm)	Part number	Width (mm)
HS20ABT053	5.3±0.1	HS20DMT053	5.3±0.1	HS20NXT053	5.3±0.1	HS20NGW5053	5.3±0.1	HS21NTK053	5.3±0.1	HS21NTKP053	5.3±0.1	HS4DWG053	5.3±0.1
HS20ABT054	5.4±0.1	HS20DMT054	5.4±0.1	HS20NXT054	5.4±0.1	HS20NGW5054	5.4±0.1	HS21NTK053	5.4±0.1	HS21NTKP054	5.4±0.1	HS4DWG054	5.4±0.1
HS20ABT092	9.2±0.1	HS20DMT092	9.2±0.1	HS20NXT092	9.2±0.1	HS20NGW5092	9.2±0.1	HS21NTK053	9.2±0.1	HS21NTKP092	9.2±0.1	HS4DWG092	9.2±0.1
HS20ABT093	9.3±0.1	HS20DMT093	9.3±0.1	HS20NXT093	9.3±0.1	HS20NGW5093	9.3±0.1	HS21NTK053	9.3±0.1	HS21NTKP093	9.3±0.1	HS4DWG093	9.3±0.1
HS20ABT133	13.3±0.1	HS20DMT133	13.3±0.1	HS20NXT133	13.3±0.1	HS20NGW5133	13.3±0.1	HS21NTK053	13.3±0.1	HS21NTKP133	13.3±0.1	HS4DWG133	13.3±0.1
HS20ABT210	21.0±0.1	HS20DMT210	21.0±0.1	HS20NXT210	21.0±0.1	HS20NGW5210	21.0±0.1	HS21NTK053	21.0±0.1	HS21NTKP210	21.0±0.1	HS4DWG210	21.0±0.1
HS20ABT255	25.5±0.1	HS20DMT255	25.5±0.1	HS20NXT255	25.5±0.1	HS20NGW5255	25.5±0.1	HS21NTK053	25.5±0.1	HS21NTKP255	25.5±0.1	HS4DWG255	25.5±0.1
HS20ABT375	37.5±0.1	HS20DMT375	37.5±0.1	HS20NXT375	37.5±0.1	HS20NGW5375	37.5±0.1	HS21NTK053	37.5±0.1	HS21NTKP375	37.5±0.1	HS4DWG375	37.5±0.1
HS20ABT495	49.5±0.1	HS20DMT495	49.5±0.1	HS20NXT495	49.5±0.1	HS20NGW5495	49.5±0.1	HS21NTK053	49.5±0.1	HS21NTKP495	49.5±0.1	HS4DWG495	49.5±0.1
HS20ABT655	65.5±0.1	HS20DMT655	65.5±0.1	HS20NXT655	65.5±0.1	HS20NGW5655	65.5±0.1	HS21NTK053	65.5±0.1	HS21NTKP655	65.5±0.1	HS4DWG655	65.5±0.1
Note: Nexteck provide 300m, 500m, 1000m, 1500m, 3000m, 4000m, or contact Nexteck sales may advise you for the availability of other widths & lengths.

Back Grinding Tape

Overview

Back grinding tapes protect the surface of wafer
circuits and prevent them from becoming
damaged during back grinding.
Features an adhesive agent that eliminates the
need for cleaning, ELEGRIP tapes ensure low
particle count and srable griding performance.

Features

Exhibts superior adhesive qualities on roughess of patterned surfaces
Ensures stable grinding performance during back grinding (Low TTV*1)
Delivers stable low particle count performance, eliminatiog the need for cleaning
Exhibits stable adhesive strength, unaffected by storage time
* 1TTV= Total ThicknessVariation

Product Number

BGE-122S / BGE-124S / P Series

Product Features

• THERMO SHEET EC - Electrical conductivity with carbon black, PS & PC based grades available, 3 layers with stable electrical conductivity.

• THERMO FILM - Cover tape film, PS, PC, PEC, PVC. Excellent sealing for heat-seal embossed carrier tapes, good peeling characteristics.

• ELEGRIP TAPE (Back Grinding Tape) - Protect the circuit surface “r”, excellent adhesion to uneven wafer surfaces on the circuit side, effective control of particles.

• ELEGRIP TAPE (Dicing Tape) - Excellent control to back-side chipping fly-off, excellent over-time stability (T Series), excellent adhesiveness (shape-following properties), excellent expandability peeling.

Services Info