When applications require the smallest form factor possible, Semiconductor customers increasingly turn to Wafer Level Chip Scale Packaging (WLCSP). This allows for size and weight advantages that can result in lower costs. To help you to respond to this trend, Nexteck Singapore Pte Ltd., provides comprehensive solutions designed to protect these advanced but fragile components, while Nexteck WLCSP precision reel and tape enhancing the efficiency of your production lines.

Nexteck Group WLCSP Carrier tapes and Cover tapes support Precision Transportation for Advanced Packaging.

With Nexteck Singapore Pte Ltd Carrier Tapes for Tiny Components, miniaturized component packages pose challenges including chip stick and migration during the tape and reel process. To help ensure smooth taping and pick and place operations, the R&D team of Nexteck Group precision carrier tape research department developed and produces carrier tapes of tighter dimension tolerance as low as 0.03 mm, smaller D1 hole down to 0.15 mm, flatter bottom with a small draft angle, and the proprietary pocket design to protect such tiny components as size 01005 mm and 0206 mm dies from damage and undesired application issues. Nexteck Singapore Pte Ltd also provide carrier tapes with narrower pitches for greater cost efficiency. With outstanding capabilities in tape design, extensive industrial expertise and an excellent track record in reel and tape product of precision quality and grade for super tiny components,  www.nexteck.com.sg is a supplier you can trust.

For further information of WLCSP 01005 grade precision carrier tape for advanced packing, Nexteck Singapore R&D team are happy to support on info@nexteck.com.sg.