Tape and Reel Packaging Standards

                                          

Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure cavity for the product when sealed with the “peel−back” cover tape.

Nexteck Singapore Pte Ltd summarized various standard assigned by Key Semiconductors players to assist to those partners and customers looking to coordinate packaging specifications with assembly line requirements. Additionally, dimensional and ordering information is supplied for those discrete devices that take the form of axial−leaded parts.

(A) SCOPE
This section covers packaging requirements for the following axial-lead component’s use in automatic testing and assembly equipment: Packaging, as covered in this section, shall consist of axial-lead components mounted by their leads on pressure sensitive tape, wound onto a reel.

(B) PURPOSE
This section establishes Semiconductor industries standard practices for lead-tape packaging of axial-lead components and meets the requirements of EIA Standard RS-296-D “Lead-taping of Components on Axial Lead Configuration for Automatic Insertion,” level 1.

(C) REQUIREMENTS

C.1. Component Leads

C.1.1 − Component leads shall not be bent beyond dimension E from their normal position.

C.1.2 − The “C” dimension shall be governed by the overall length of the reel packaged component. The distance between flanges shall be 0.059 inch to 0.315 inch greater than the overall component length

C.1.3 − Cumulative dimension “A” tolerance shall not exceed 0.059 over 6 in consecutive components.

C.2 Orientation

All polarized components must be oriented in one direction. The cathode lead tape shall be any color except white and the anode tape shall be white.

C.3 Reeling

C.3.1 − Components on any reel shall not represent more than two date codes when date code identification is required.

C.3.2 − Component’s leads shall be positioned perpendicularly between pairs of 0.250 inch tape.

C.3.3 − A minimum 12 inch leader of tape shall be provided before the first and last component on the reel.

C.3.4 − 50 lb. Kraft paper is wound between layers of components as far as necessary for component protection.

C.3.5 − Components shall be centered between tapes such that the difference between D1 and D2 does not exceed 0.055.

C.3.6 − Staples shall not be used for splicing. No more than four layers of tape shall be used in any splice area and no tape shall be offset from another by more than 0.031 inch noncumulative. Tape splices shall overlap at least 6 inches for butt joints and at least 3 inches for lap joints and shall not be weaker than unspliced tape.

C.3.7 − Quantity per reel shall be as indicated in Table 1. Orders for tape and reeled product will only be processed and shipped in full reel increments. Scheduled orders must be in releases of full reel increments or multiples thereof.

C.3.8 − A maximum of 0.25% of the components per reel quantity may be missing without consecutive missing per level 1 of RS-296-D.

C.3.9 − The single face roll pad shall be placed around the finished reel and taped securely. Each reel shall then be placed in an appropriate container.

C.4 Marking

Minimum reel and carton marking shall consist of the following :
Semiconductor Customers number
Quantity
Manufacturer’s name
Date codes (when applicable; please refer to www.nexteck.com.sg or info@nexteck.com.sg

All www.nexteck.com.sg Packing materials (carrier tape, cover tape) partners and customers, please aware that if your vendors' requirements differing from this Semiconductor Industries standard please be negotiated with the order factory.

Our Products

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Cover Tape

ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency

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Thermo film

Cover tape film with excellent sealing performance

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DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

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BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding

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