Product Information

Nexteck Singapore Pte Ltd., www.nexteck.com.sg proud to introduce key materials in semi-conductor production.

Outline

Back grinding tape is used to protect the circuit surface r from damage by foreign matter, chipping, cracking and contamination during back grinding process. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling. Elegrip BG tape meets these requirements. In addition, it is water insoluble, making it effectively use around water and making washing unnecessary. Nexteck Singapore Pte Ltd keep stocks in Singapore, Malaysia, Thailand for delivery within 12 hour.

Characteristics

·      Excellent adhesion to an uneven wafer surfaces, such as on the circuit side

·      Effective control of particles

·      Excellent grinding accuracy (TTV) and good water-seepage control during back grinding

·      Easy peeling

·      Effective control on adhesive deterioration with time

Nexteck Singapore is the major supplier, direct deal with users, nexteck.com.sg goal is to support “Cost Down” for customers.

info@nexteck.com.sg is pleased to be of your service.