PLCC (plastic-leaded chip carrier) Chips has a rectangular plastic housing.

A premolded PLCC was originally released in 1976, but did not see much market adoption by most major semiconductor companies. To the knowledge of Nexteck Singapore Pte Ltd., the JEDEC trade group started a task force in 1981 to categorize PLCCs, with the MO-047 standard released in 1984 for square packages and the MO-052 standard released in 1985 for rectangular packages.^[4] The PLCC utilizes a "J"-lead with pin spacings of 0.05" (1.27 mm). The PLCC is preferred over DIP style chip carriers when lead counts exceed 40 pins due to the PLCC's more efficient use of board surface area.

A PLCC circuit may either be installed in a PLCC socket or surface-mounted. PLCC sockets may in turn be surface mounted, or use through-hole technology. The motivation for a surface-mount PLCC socket would be when working with devices that cannot withstand the heat involved during the reflow process, or to allow for component replacement without reworking. Using a PLCC socket may be necessary in situations where the device requires stand-alone programming, such as some flash memory devices. Some through-hole sockets are designed for prototyping with wire wrapping. All PLCC need intensive packing materials which can be supplied by Nexteck Singapore Pte Ltd.

This package is still used for a wide variety of device types, which would include memory, processors, controllers, ASICs, DSPs, etc. It is particularly common for read-only memories as it provides an easily swappable socketed chip. Applications range from consumer products through automotive and aerospace. For further information about packing materials or DENKA carrier tape, cover tape, PI tape products, Please feel free to contact nexteck.com.sg or info@nexteck.com.sg or Nexteck Singapore Pte Ltd.