What Are Semiconductor Packaging and Packing Materials ?


Semiconductor packaging materials is a product of NEXTECK Group, www.nexteck.co.uk which are a class of electronic solutions used to form the connection IC chip to the package substrates, therefore other package or directly to the printed circuit board. These materials are critical to semiconductor wafer-level packaging processes, heterogeneous integration& 3D integration technology.

Under the same roof, Nexteck Singapore Pte Ltd supply Packing Materials, like Cover Tape Films (which now developed by the engineers of
www.nexteck.com.sg the standard length for “Cross Winding” cover tape is 1500 meter/roll and can be customized to 6000 meter/ roll. Other like Carry Tape, PI Tape, Dicing Tapes which are widely use at the back stage of semiconductor industry.
 

What Packing Materials do you need ?


Nexteck Singapore Pte Ltd., love to talk about how our electronic solutions can build business, commercialize products and solve the greater challenges of our time. Please feel free to contact NEXTECK GROUP by info@nexteck.com.sg or www.nexteck.com or www.nexteck.com.sg




Our Products

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Cover Tape

ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency

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Thermo film

Cover tape film with excellent sealing performance

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DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

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BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding

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