EC-AP2 Higher strength and ultra-thin PC series sheets.-cover tape|carrier tapes|NEXTECK

EC-AP2 Higher strength and ultra-thin PC series sheets.

EC and Clearen Sheet have been used and reputed as standard materials for carrier tapes.

Various grades available for semiconductors and electronic components.

Years ofaccumulation andtrust

Completed carrier tapes for semiconductor and electronic parts

3. Ultra-thin and high strength EC-AP sheet for parts miniaturization developed recently.

Carrier Tape Product Features

Suitable for various molding methods and shows good moldability and size accuracy.

Excellent sealing performance with covertapes.

Stable conductivity to protect contents from static electricity.

High transparency for easy recognition of contents. (CST-2401)

Higher strength and ultra-thin than the former PC series sheets.(EC-AP2)

Anti-static performance to prevent carrier sheet from dust. (EC-TP2)

Each items of NEXTECK win years of accumulation and trust. Products used for semiconductors and electronic parts are very completed and with varied shaping methods，excellent forming property and size precision.

Our Products

Cover Tape

ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency

Thermo film

Cover tape film with excellent sealing performance

DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding