Dicing Tape - UV Series 

A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components.

With greater diversity and higher quality in chips, dicing tapes also require advanced technology.
 

Dicing tapes of NEXTECK are widely used in a variety of applications including slicing , single EMC encapsulation substrate , drive IC , LTCC substrate , silicon chip , ceramics , glass, and optical lens .

UV series dicing types have ultra high crystallized ability by adhesion and ultraviolet irradiation , easy to be peeled , without remains and anti-static. We provide whole roll as well as customized shapes.

NEXTECK provides customized tapes to meet all kinds of requirements.