NEXTECK WLCSP Carrier Tape Raised & Depressed Cross Bar

   


If Chip Size < 1x1mm, Raised Cross Bar Design to be used
For “ Raised Cross Bar Design “, K0=A+0.100, K1=K0+0.03 ( Raised Cross Bar ), it would have enough gap to placing the device during taping process and would also avoid the tilt device & sticking device phenomenon after Cover Tape Sealing in Nexteck Singapore Pte Ltd.

This Tooling would be more precise than others so that the unit cost would also be more higher than others. But precision is the core value of Nexteck Group.


If Chip Size >1x1mm, Depressed Cross Bar Design to be used

For “ Depressed Cross Bar Design “, K0=A+0.155, K1=K0-0.03 ( Depressed Cross Bar ), it would have enough gap to placing the device during taping process and would also avoid the tilt device & sticking device phenomenon after Cover Tape Sealing under the production rule of www.nexteck.com.sg.

                  

 
 

Our Products

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Cover Tape

ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency

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Thermo film

Cover tape film with excellent sealing performance

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DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

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BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding

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