Wafer Dicing and Dicing Tape-cover tape|carrier tapes|NEXTECK

Wafer Dicing and Dicing Tape

Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer microfabrication. The tape holds the pieces of semiconductor, known as die, together during the cutting process, mounting them to a thin metal frame. The die are removed from the dicing tape later on in the electronics manufacturing process.

Nexteck Singapore Pte Ltd dicing tapes series are of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the die in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafer. It is available in a variety of thicknesses, from 75 to 150 micrometers, with a variety of adhesive strengths, designed for various chip sizes and materials. UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, Denkaand easy removal. UV equipment can range from low power (a few mW/cm2) to high power (more than 200 mW/cm2). Higher power results in a more complete cure, lower adhesion and reduced adhesive residue.

www.nexteck.com.sg series of dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.

A. Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small dies

B. Supports instant control of adhesion by UV irradiation, allowing large dies to be picked up easily

C. Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on IC chips

D. We have a variety of products to meet customers' process and application.

E. Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standards.

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Wafer Dicing and Dicing Tape

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