NEXTECK Will Take Part in SEMICON Taiwan 2019

Nexteck Group will display new products — packing material DENKA COVER TAPE and full range of DENKA ELEGRAP TAPE in SEMICON Taiwan 2019 at booth I2011. The exhibition will be held from Sep 18 to Sep 20, 2019 in Taipei Nangang Exhibition Center for the 12th time. Customers are welcome to be here for face-to-face appointment and visual review.

 NEXTECK Will Take Part in SEMICON Taiwan 2019

SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, the academia, and research institutions. Witnessing enormous business collaboration, SEMICON Taiwan still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing various channels and activities that meet the companies' marketing and promotion needs.

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Started from 1996, more than 680 enterprises attend SEMICON Taiwan. The exhibition space cover an area of 13320 square meters. Up to 31847 visitors participate this feast.

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As an important semiconductor production base in the world, Taiwan's manufacturing and high-tech industries are developed, and the semiconductor, IT, communications, and electronic precision manufacturing industries are leading the world. Nexteck Group is horned to meet all the customers here to witness the boost of all the industries.

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Nexteck takes part in exhibitions regularly every year, such as ELECTRONICA China, NEPCON electronics, wirechina and so on.


Our Products

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Cover Tape

ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency

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Thermo film

Cover tape film with excellent sealing performance

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DICING TAPE

Dicing Tape,fixing semicon, silicon, GaAs during dicing

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BACK GRINDING TAPE

Back Grinding Tape,protect circuit surface during back grinding

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